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STTH4R02
Ultrafast recovery diode
Main product characteristics
IF(AV) VRRM Tj (max) VF (typ) trr (typ) 4A 200 V 175 C 0.76 V 16 ns
A K
K
K
A
A K TO-220FPAC STTH4R02FP
TO-220AC STTH4R02D
Features and benefits

Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature
K A NC
DPAK STTH4R02B
A K
SMB STTH4R02U
Description
The STTH4R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in TO-220AC, TO-220FPAC, DPAK, SMB, SMC, and DO-201AB, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection.
A A K K
DO-201AB STTH4R02 SMC STTH4R02S
Order codes
Part Number STTH4R02D STTH4R02FP STTH4R02B STTH4R02B-TR STTH4R02U STTH4R02 STTH4R02RL STTH4R02S Marking STTH4R02 STTH4R02 STTH4R02 STTH4R02 4R2U STTH4R02 STTH4R02 4R2S
October 2006
Rev 2
www.st.com
1/13
13
Characteristics
STTH4R02
1
Table 1.
Symbol VRRM
Characteristics
Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified)
Parameter Repetitive peak reverse voltage TO-220AC DPAK IF(RMS) RMS forward current SMB / SMC TO-220FPAC DO-201AB TO-220AC DPAK IF(AV) Average forward current, = 0.5 SMB SMC TO-220FPAC DO-201AB IFSM Tstg Tj Surge non repetitive forward current Storage temperature range Maximum operating junction temperature tp = 10 ms Sinusoidal Tc = 160 C Tc = 160 C Tc = 95 C Tc = 95 C Tc = 150 C Tlead = 95 C 70 -65 to + 175 175 A C C 4 A 70 A Value 200 Unit V
Table 2.
Symbol
Thermal parameters
Parameter TO-220AC / DPAK SMB Value 3.5 20 6.5 20 20 C/W Unit
Rth(j-c)
Junction to case
TO-220FPAC DO-201AB SMC
2/13
STTH4R02 Table 3.
Symbol IR(1)
Characteristics Static electrical characteristics
Parameter Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM IF = 12 A IF = 4 A Min. Typ Max. 3 A 2 1.15 0.95 0.76 20 1.25 1.05 0.83 V Unit
Reverse leakage current
VF(2)
Forward voltage drop
Tj = 25 C Tj = 150 C
1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %
To evaluate the conduction losses use the following equation: P = 0.67 x IF(AV) + 0.04 IF2(RMS) Table 4.
Symbol
Dynamic characteristics
Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C Reverse recovery current Forward recovery time Forward recovery voltage IF = 4 A, dIF/dt = -200 A/s, VR = 160 V, Tj = 125 C IF = 4 A, dIF/dt = 50 A/s VFR = 1.1 x VFmax, Tj = 25 C IF = 4 A, dIF/dt = 50 A/s, Tj = 25 C Min. Typ 24 16 4.4 80 1.6 Max. 30 ns 20 5.5 A ns V Unit
trr
Reverse recovery time
IRM tfr VFP
Figure 1.
IM(A)
50
peak current versus duty cycle
Figure 2.
IFM(A)
Forward voltage drop versus forward current (typical values)
T
100
45 40 35 30 25 20 15 10 5
P=2W P=5W
IM
d=tp/T
tp
75
50
Tj=150C
Tj=25C
P=1W
25
0 0.0 0.5 1.0 1.5 2.0 2.5
VFM(V)
3.0 3.5
0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
3/13
Characteristics
STTH4R02
Figure 3.
Forward voltage drop versus forward current (maximum values)
Figure 4.
Relative variation of thermal impedance, junction to case, versus pulse duration (T0-220AC, DPAK)
IFM(A)
100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VFM(V)
Tj=25C Tj=150C
Zth(j-c)/Rth(j-c)
1.0
Single pulse TO-220AC DPAK
tp(s) 0.1 1.E-03 1.E-02 1.E-01 1.E+00
Figure 5.
Relative variation of thermal impedance, junction to case, versus pulse duration (TO-220FPAC)
Figure 6.
Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMB)
Zth(j-c)/Rth(j-c)
1.0
Single pulse TO-220FPAC
Zth(j-a) /Rth(j-a)
1.0 0.9 0.8 0.7 0.6
SMB SCu=1cm
0.1
0.5 0.4 0.3 0.2 0.1
tp(s) 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
0.0 1.E-01 1.E+00 1.E+01 1.E+02
tp(s) 1.E+03
Figure 7.
Relative variation of thermal impedance, junction to ambient, versus pulse duration (DO-201AB)
Figure 8.
Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMC)
Zth(j-a) (C/W)
100
Single pulse DO201AB
Zth(j-a) /Rth(j-a)
1.0 0.9 0.8 0.7 0.6
SMC SCu=1cm
10
0.5 0.4 0.3 0.2
tp(s) 1 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
0.1 0.0 1.E-01 1.E+00
tp(s)
1.E+01
1.E+02
1.E+03
4/13
STTH4R02
Characteristics
Figure 9.
Junction capacitance versus reverse applied voltage (typical values)
Figure 10. Reverse recovery charges versus dIF/dt (typical values)
QRR(nC)
120
C(pF)
100
F=1MHz Vosc=30mVRMS Tj=25C
100
IF=4A VR=160V Tj=125C
80
60
40
Tj=25C
20
VR(V) 10 1 10 100 1000
dIF/dt(A/s) 0 0 50 100 150 200 250 300 350 400 450 500
Figure 11. Reverse recovery time versus dIF/dt Figure 12. Peak reverse recovery current (typical values) versus dIF/dt (typical values)
tRR(ns)
80 70 60 50 40
Tj=125C IF=4A VR=160V
IRM(A)
10
IF=4A VR=160V
8
6
Tj=125C
30 20 10 0 10 100 1000
Tj=25C
4
Tj=25C
2
dIF/dt(A/s)
0 0 50 100 150 200 250 300 350
dIF/dt(A/s) 400 450 500
Figure 13. Dynamic parameters versus junction temperature
Figure 14. Thermal resistance, junction to ambient, versus copper surface under tab - DPAK (Epoxy printed circuit board FR4, eCU = 35 m)
Rth(j-a) (C/W)
100 90 80
DPAK
QRR; IRM [T j] / Q RR; IRM [T j=125C]
1.4 1.2 1.0 0.8 0.6
QRR IRM IF=4A VR=160V
70 60 50 40 30 20
0.4 0.2 Tj(C) 0.0 25 50 75 100 125 150
10 0 0 5 10 15 20 25 30
SCU(cm) 35 40
5/13
Ordering information scheme
STTH4R02
Figure 15. Thermal resistance, junction to ambient, versus copper surface under tab - SMB (Epoxy printed circuit board FR4, eCU = 35 m)
Rth(j-a) (C/W)
110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCU(cm)
SMB
Figure 16. Thermal resistance, junction to ambient, versus copper surface under tab - SMC (Epoxy printed circuit board FR4, eCU = 35 m)
Rth(j-a) (C/W)
100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCU(cm)
SMC
Figure 17. Thermal resistance versus lead length - DO-201AB
90 80 70 60 50 40 30 20 10 0 5 10 15 20 25 LLEADS(mm)
Rth(j-l)
Rth(C/W)
Rth(j-a) DO201AB
2
Ordering information scheme
STTH
Ultrafast switching diode Average forward current 4=4A Model R Repetitive peak reverse voltage 02 = 200 V Package Blank = DO-201 in Ammopack RL = DO201 in Tape and reel D = TO220AC in Tube FP = TO-220FPAC in Tube B = DPAK in Tube B-TR = DPAK in Tape and reel U = SMB in Tape and reel S = SMC in Tape and reel
4R
02 XXX
6/13
STTH4R02
Package information
3
Package information
Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. T0-220AC dimensions
DIMENSIONS REF. Millimeters Min.
H2 OI L5 L7 L6 L2 C A
Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409
Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40
A C D E F F1 G
4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00
F1
L9 L4 F
D
H2 L2 L4
16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93
0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154
M E
L5 L6
G
L7 L9 M Diam. I
2.6 typ. 3.75 3.85
0.102 typ. 0.147 0.151
7/13
Package information Table 6. DPAK dimensions
STTH4R02
DIMENSIONS REF . Millimeters Min.
E B2 L2 C2 A
Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10
A A1 A2 B
D
2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35
B2 C C2
H L4 B G A1
R
R C
D E G
A2 0.60 MIN.
H L2
V2
0.80 typ. 0.60 0 1.00 8
0.031 typ. 0.023 0 0.039 8
L4 V2
Figure 18. DPAK footprint
1.6
6.7
3
3
2.3 6.7 2.3
1.6
Dimensions in mm
8/13
STTH4R02 Table 7. T0-220FPAC dimensions
Package information
DIMENSIONS REF Millimeters Min.
A H B
Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409
Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4
A B D
4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10
Dia L6 L2 L3 L5 F1 L4 D L7
E F F1 G G1 H L2 L3
16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20
0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126
F G1
E
L4 L5
G
L6 L7 Dia.
9/13
Package information Table 8. SMB dimensions
STTH4R02
DIMENSIONS
E1
REF.
Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60
Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063
A1
D
1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75
A2 b
E A1 A2 L b
c E
c
E1 E2 D L
Figure 19. SMB footprint (dimensions in mm)
5.25
2.22
1.75
1.75
1.75
10/13
STTH4R02 Table 9. SMC dimensions
Package information
Dimensions Ref.
E1
Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60
Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063
A1
D
1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75
A2 b
E
c E
A1
E1
b
C E2 L
A2
E2 D L
Figure 20. SMC footprint (dimensions in mm)
2.20 4.25 2.20
3.30
8.65
Table 10.
DO-201AB Dimensions
DIMENSIONS
B A B
REF.
Millimeters Min. Max. 9.5
Inches Min. 0.335 1 Max. 0.374
OD OC
A B OC OD
8.5 25.4 4.8 0.96
5.3 1.06
0.189 0.038
0.209 0.042
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
11/13
Ordering information
STTH4R02
4
Ordering information
Part Number STTH4R02D STTH4R02FP STTH4R02B STTH4R02B-TR STTH4R02U STTH4R02 STTH4R02RL STTH4R02S Marking STTH4R02 STTH4R02 STTH4R02 STTH4R02 4R2U STTH4R02 STTH4R02 4R2S Package TO-220AC TO-220FPAC DPAK DPAK SMB DO-201AB DO-201AB SMC Weight 1.86 g 2.2 g 0.30 g 0.30 g 0.107 g 0.876 g 0.876 g 0.243 g Base qty 50 50 75 2500 2500 600 1900 2500 Delivery mode Tube Tube Tube Tape and reel Tape and reel Ammopack Tape and reel Tape and reel
5
Revision history
Date 03-May-2006 10-Oct-2006 Revision 1 2 First issue. Added SMC package Description of Changes
12/13
STTH4R02
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